- Get link
- X
- Other Apps
- Get link
- X
- Other Apps
Moore's Law 2025: 2nm Nodes, 100B Transistors, 3nm Phone SoCs, $600B Semiconductor Market
❓ Transistor Density Doubling?
Moore's Law: 2x transistors every 2 years. 1971: 2,300/chip → 2025: 100B/chip. 2nm gate length, 40% performance/2x density per node shrink.
FinFET → GAA Transistor Evolution
2nm GAAFET: 30nm pitch vs 40nm FinFET. Gate-all-around wraps 3 sides vs FinFET 2 sides. Drive current 1.4mA/μm, leakage <1nA/μm. EUV lithography achieves ±1.5nm CD control at 36nm metal pitch.
| Node | Transistors | Gate Length | Performance |
|---|---|---|---|
| 2nm GAA | 100B | 12nm | 1.4mA/μm |
| 3nm FinFET | 60B | 18nm | 1.1mA/μm |
| 5nm | 30B | 24nm | 0.9mA/μm |
Semiconductors power AI training, self-driving cars, 6G networks.
Smartphone SoC Engineering
Apple A19: 3nm, 6.8BTFLOPS NPU, 40% faster vs A18. 7x7cm die powers 6.9" 120Hz LTPO OLED, 48MP sensor. TSMC CoWoS packaging stacks HBM3 memory for 1.5TB/s bandwidth. Battery life 28hrs video playback.
Laptop Miniaturization Specs
Intel Lunar Lake: 4nm, 45W TDP, 48 TOPS NPU in 0.635cm² SoC. 16"→13.4" chassis shrink via System-on-Wafer. Copper-to-copper direct bonding cuts thermal resistance 40%. 20hr battery at 1080p.
| Device | Process | TFLOPS | Screen Size |
|---|---|---|---|
| Phone SoC | 3nm | 6.8B | 6.9" |
| Laptop CPU | 4nm | 48 TOPS | 13.4" |
| Desktop GPU | 5nm | 120 TFLOPS | Desktop |
Foundry Market Leaders 2025
| Foundry | Node | Capacity | Revenue |
|---|---|---|---|
| TSMC | 2nm/3nm | 15M wafers/yr | $350B |
| Samsung | 3nm GAA | 8M wafers/yr | $120B |
| Intel | 20A/18A | 5M wafers/yr | $80B |
Moore's Law Engineering Impact
1971→2025: 43M× transistor growth. Compute: 10K→100P FLOPS. Cost/chip: $10K→$0.10. Enables GPT-5 10T params, autonomous L5 driving, quantum simulation 1000 qubits.
- Get link
- X
- Other Apps
Comments
Post a Comment